5961-01-029-5450, SEMICONDUCTOR DEVICES,UNITIZED

5999-01-029-5449 MOUNTING PAD,ELECTRICAL-ELECTRON

National Stock Number:
5961-01-029-5450

Federal Supply Class:
5961

National Item Identification Number:
010295450

Description:
SEMICONDUCTOR DEVICES,UNITIZED

Detail:
Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Manufacturer Information:

247ASC0942-001	30003	NAVAL AIR SYSTEMS COMMAND MANAGED ORIGINAL DESIGN ACTIVITY NOT MATERIAL/PARTS SUPPLIER
304270-1	26916	NORTHROP GRUMMAN SYSTEMS CORPORATION
FSA1410M	07263	FAIRCHILD SEMICONDUCTOR CORP
FSA1410MQB	07263	FAIRCHILD SEMICONDUCTOR CORP
304270-2	15280	NORTHROP GRUMMAN SYSTEMS CORPORATION DIV ES DEFENSIVE SYSTEMS DIVISION
304270-2	26916	NORTHROP GRUMMAN SYSTEMS CORPORATION
TS-2409	54485	MICROSEMI CORP.- MASSACHUSETTS DBA MICROSEMI LAWRENCE

Techincal Specification:

COMPONENT NAME AND QUANTITY	8 SEMICONDUCTOR DEVICE DIODE
CURRENT RATING PER CHARACTERISTIC	350.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC ALL SEMICONDUCTOR DEVICE DIODE
FEATURES PROVIDED	HERMETICALLY SEALED CASE
OVERALL DIAMETER	0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM
OVERALL LENGTH	0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT	150.0 CELSIUS AMBIENT AIR
MOUNTING METHOD	TERMINAL
SPECIAL FEATURES	ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN
POWER RATING PER CHARACTERISTIC	600.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION ALL SEMICONDUCTOR DEVICE DIODE
SEMICONDUCTOR MATERIAL	SILICON ALL SEMICONDUCTOR DEVICE DIODE
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC	55.0 MAXIMUM WORKING PEAK REVERSE VOLTAGE ALL SEMICONDUCTOR DEVICE DIODE
TERMINAL CIRCLE DIAMETER	0.230 INCHES NOMINAL
TERMINAL LENGTH	0.500 INCHES MINIMUM
TERMINAL TYPE AND QUANTITY	9 UNINSULATED WIRE LEAD

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