BODY HEIGHT | 0.080 INCHES MAXIMUM |
BODY LENGTH | 1.060 INCHES MINIMUM AND 1.110 INCHES MAXIMUM |
BODY WIDTH | 0.390 INCHES MINIMUM AND 0.410 INCHES MAXIMUM |
FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND LOW POWER AND ELECTROSTATIC SENSITIVE AND BIDIRECTIONAL AND W/ENABLE |
INCLOSURE CONFIGURATION | DUAL-IN-LINE |
INCLOSURE MATERIAL | CERAMIC |
INPUT CIRCUIT PATTERN | 19 INPUT |
OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
MAXIMUM POWER DISSIPATION RATING | 1.25 WATTS |
MEMORY CAPACITY | UNKNOWN |
MEMORY DEVICE TYPE | RAM |
OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
TERMINAL SURFACE TREATMENT | SOLDER |
TERMINAL TYPE AND QUANTITY | 22 PRINTED CIRCUIT |
TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TIME RATING PER CHACTERISTIC | 400.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 400.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |