| BODY HEIGHT | 0.105 INCHES MINIMUM AND 0.125 INCHES MAXIMUM |
| BODY LENGTH | 0.765 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| BODY WIDTH | 0.440 INCHES MINIMUM AND 0.460 INCHES MAXIMUM |
| FEATURES PROVIDED | MONOLITHIC |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, MEMORY, DIGITAL, CMOS 4MEG X 4 DRAM, MONOLITHIC SILICON |
| MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| MEMORY DEVICE TYPE | RAM |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| SPECIAL FEATURES | RECOMMENDED OPERATING SUPPLY (VCC) 4.5 TO 5.5 VDC |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL TYPE AND QUANTITY | 24 LEADLESS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TIME RATING PER CHACTERISTIC | 100.00 NANOSECONDS NOMINAL ACCESS |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.0 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT |